Differential Isometric Processing and Simulation Verification of High-Speed PCB Design

Differential pair refers to a pair of coupling transmission lines. The transmission of differential signal is the process in which two output drivers drive differential pair one of which features signals while the other features its complementary signal. Voltage difference between differential pairs is the most required, ...

PCB Design and Research on High-Speed Password Card Based on PCIE

At present, the fast development of Internet technology witnesses the massive application of email, online payment and personal communication. Under this background, information security has been a critical research theme around the world. PKI (Public Key Infrastructure) technology provides ...

Research on High-Speed PCB Design in Embedded Application System

Modern electronic system is developing in the trend of small package, large scale and high speed as the density of chips is becoming increasingly large in SLSI (super-large-scale integration), which brings about some inevitable problems such as how to analyze and deal with the interconnections and stacking ...

Influence on Soldermask Thickness Uniformity by Silkscreen Printing Nail-Bed Design

The trend of miniature of electronic products leads to complicated structures of products, which promotes the prevalence of multi-chip module. The advent of core module is a new challenge for SMT. However, some problems such as false welding and continuous tin electrodeposit come up in the new ...

SMT Soldering Reliability Research Based on Circuit Module in Automotive Electronic Industry

The trend of miniature of electronic products leads to complicated structures of products, which promotes the prevalence of multi-chip module. The advent of core module is a new challenge for SMT. However, some problems such as false welding and continuous tin electrodeposit come up in the new ...

Application of Bottom Filling Technology in Printed Circuit Board Assembly

Bottom filling can be classified into fluidity bottom filling based on capillary flow theory and nonfluidity bottom filling. Up to now, bottom filling technology suitable for chips of BGA, CSP etc. mainly includes: capillary bottom filling technology, SMT hot melt adhesive sheet technology, ACA (Anisotropically Conductive Adhesives) ...

Influence on Printing Quality of PCB Based on Bad Design of Fiducial Marks

As an important carrier of all kinds of electronic components, PCBs provide excellent mechanical support for components and connect those components through copper foil lines with different thickness and soldering pads with different sizes according to logical circuits to implement ...

Design Requirement of SMT PCBs Part Four: Mark

In order to correct the errors generated in the process of PCB fabrication, Mark refers to a set of patterns used for optical localization. Mark can be classified into PCB Mark and local Mark. ...

Design Requirement of SMT PCBs Part Three: Component Layout Design

Component layout has to meet both the requirement of the whole machine electric properties and mechanical structure and the requirement of SMT production craft. Since it's difficult to overcome product quality problem caused by design, PCB design engineers ...

Design Requirement of SMT PCBs Part Two: Settings of Pad-Trace Connection, Thru-Holes, Test Point, Solder Mask and Silkscreen

This series of articles will display the most comprehensive design requirements of SMT PCBs. In this article, settings of pad-trace connection, thru-holes, test point, solder mask and silkscreen will be discussed. ...

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