Dear Customers

PCBCart will have the official holidays since Jan. 24th through Feb. 3rd for Chinese Lunar New Year. Please schedule your order earlier (about half a month earlier for bare PCB orders and start assembly orders from beginning of December) to ensure that the products could be manufactured and delivered on time before our holiday. If the orders with delivery date scheduled around those days need to be delivered before holiday, please contact us. Production line for Prototype PCB will be stopped from Jan 22nd to Feb 5th, 2017. We are doing equipment maintenance, so for new orders received from Jan 19th-22nd, we will make tools before holiday and start production after Feb 5th, 2017.

Factors Determining the Number of Layers and Layer Distribution in PCBs

A lot of identifications contribute to the wide use of Printed Circuit Boards (PCBs), including electronic components, platforms for electronic parts, and electronic connection providers. According to the number of layers, PCBs can be classified into the following three categories: single, double and multilayer PCBs. Ordinarily, multilayer ...

Design of High-Power PCB in High Temperature Environment

As the commonest components integrated platform, multi-layer PCBs are capable of connecting PCBs and components together. With electronic products becoming light, thin and small in size, and having high performance, IC components have become highly integrated, leading to the high ...

How to Design Image Planes for High-Speed PCBs

Nowadays, multilayer PCBs are used in most high-speed circuit systems and lots of circuit systems have numerous operating powers, providing strict requirements to image planes design, especially the settlement of relationships between multiple power/ground planes. Besides, special copper clad surface needs to be designed ...

3 Routing Techniques on PCB High-speed Signal Circuit Design

Printed Circuit Board (PCB) design is essential to the work of electric engineers and it's not apparently easy to design a perfect PCB. A perfect PCB derives from not only its rationality of component selection and distribution but its high signal conductivity as well. In this thesis, the knowledge on ...

Misunderstandings and Strategies on High-Speed PCB Design

As far as high-speed electronic systems are concerned, the success of printed circuit board design directly leads to the high problem solving in Electro Magnetic Compatibility (EMC) system in both theory and practice. In order to reach the EMC standard, high-speed PCB design is facing great ...

High-Speed Layout Tips

Most PCB designs start out with a correct and verified schematic in hand. The hard work of then converting the schematic design into a final PCB must then be undertaken. Quite often, even though the original design has been undertaken with care, the PCB version of the design will fail to work. Even if a schematic has been verified using a ...

Mixed Signal Layout Considerations

Quite often a printed circuit board (PCB) design will contain both an analog section and a digital section. The analog section typically conditions a signal for digitization and the digital section converts the analog signal to a digital one and then acts on the now digital domain signal. Segregating these two blocks of a ...

Tips of Thermal Design for PCBs Controlled by FPGA System

Recent years has witnessed miniaturization, integrity and modularization of electronic products, leading to the escalation in terms of assembly density of electronic components and decrease in terms of effective thermal dissipation area. Therefore, thermal design of high-power electronic components ...

Internal Thermal Dissipation Design of PCB based on Thermal Model

Fast development of electronic technology leads to instant improvement in terms of computational speed, computational frequency and integrity of electronic products. Besides, with the volume of electronic products shrinking, volumetric power density is becoming increasingly high. ...

PCB Thermal Design Considerations

With power components coming in smaller and smaller surface mount packages it is very important to come up with a coherent approach to mitigating the thermal dissipation requirements of these components in a PCB design. While the development of ...

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