Efficiency and quality have been playing a critical role in the values PCBCart sticks to since they are both important for our customers. Also, with the fast development of electronic technologies, electronic products are becoming more complicated, miniature and integrating, leading to higher density and complexities of printed circuit boards. Therefore, high efficiency and correctness of finding defects in PCB assembly process allows instant exposure of defects and ensures the high quality of the remaining PCB assemblies. In addition, conventional visual inspection fails to meet requirements of high density and complexities. In this way, PCBCart depends on Automated Optical Inspection (AOI).
As a primary testing technique in PCB assembly, AOI applies to fast and accurate inspection of errors or defects occurring in PCB assembly process so that high quality of PCB assemblies can be ensured with no defect after their leaving assembly line. AOI can be applied both to bare PCBs and PCB assembly. Here at PCBCart, we mainly apply AOI to inspect SMT (Surface Mount Technology) assembly line and for testing of bare circuit boards, flying probe is used instead.
PCBCart uses model ALD515 as AOI equipment, its image and attributes are displayed below.
Depending on a high-definition camera, ALD515 captures PCB surface images with the help of numerous light sources. Then, compare between the captured image and board parameters that have been input into computer earlier so that differences, abnormalities or even errors can be clearly indicated by its built-in processing software.
AOI is contributive to efficiency improvement as it is placed on SMT assembly line after reflow. Once problems are inspected and reported, engineers can change corresponding parameters in the previous stages of the assembly line so that remaining products will be correctly assembled.
Defects AOI can cover primarily come in soldering and components categories. In terms of soldering, defects can range from open circuits, solder bridges, solder shorts, insufficient solder to excess solder. Component defects include lifted lead, missing component, misaligned or misplaced components.