| Features |
Capability |
| Layers |
1-10 layers |
| Material |
FR4 |
| Copper Thickness |
1/2 to 6oz (18um-210um) |
| Board Thickness |
.016-.126" (0.4mm-3.2mm) |
| Surface finish |
HASL,Ni/Au,OSP |
| Soldermask |
LPI, different colors |
| Board Dimension |
600x700mm |
| Min Hole Diameter |
6mil (0.15mm) |
| Min line width |
4mil (0.1mm) |
| Min line spacing |
4mil (0.1mm) |
| Min SMT pitch |
8mil (0.2mm) |
| Min. width of slots |
0.8mm |
| Max. thickness of Au in ENIG |
3-5micro inches |
| Surface/hole plating |
ave. 25um min. 20um |
| Tolerance: |
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| Hole Tolerance |
+/-003"(+/-0.08mm)~+/-.006"(+/-0.15mm) |
| Thickness Tolerance |
+/-.004" (+/-0.1mm)~+/-10% |
| Copper Thickness Tolerance |
-0um+20um |
| SM Tolerance (LPI) |
.003"(0.075mm) |
| Dimension Tolerance |
.004"(0.1mm)~0.012"(0.3mm) |
| Electrically test |
10V-250V, flying probe or testing fixture |
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| Last update time: Sept 13, 2012 |
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