Since  May Day holiday is approaching, we’d like to inform you that we’ll have two days holiday from 

May 1-2, during which your question or email may not be replied immediately. However, quotation or orders can be submitted online as usual.


PCBCart Team

Apr 29th, 2025


PCBCart Thailand Factory—Fully Prepared for Production, Coming Soon!   Learn More

BGA Assembly Capabilities

Detailed introduction to BGA assembly capabilities | PCBCart
Capability Standard
Types of BGA

- Plastic Laminate BGA (PBGA)

- Tape Ball Grid Array(TBGA)

- Ceramic Ball Grid Array (CBGA)

- Flip Chip Ball Grid Array (FCBGA)

- Enhanced Ball Grid Array (EBGA)

- Micro BGA

- Package on Package (PoP)

- Chip Scale Package (CSP)

- Wafer level chip scale packaging (WLCSP)
BGA CSP

Package Dimension: from 5mm x 5mm to 45mm x 45mm

Minimum Solder Ball Pitch: 0.3 mm/0.5 mm

Minimum Solder Ball Diameter: 0.15 mm/0.25 mm

Minimum Solder Ball Height: 0.25mm
Chip Package

BGA/LGA/HDA/POP/uBGA/WLCSP/CSP
Quality Assurance

- Automated Optical Inspection

- X-ray inspection

- Functional Testing
BGA rework

- PCB Reballing

- BGA Site Modification

- Correcting Damaged or Missing BGA Pads

- Component removal and replacement

BGA Product Assembly Process at PCBCart

At PCBCart, our process for assembling BGA (Ball Grid Array) components is all about precision and quality. From the moment materials arrive, every phase—initial material inspection, precision soldering, meticulous testing, and secure packaging—follows industry standards and meets our clients' needs. Our experienced technicians use advanced technology and skilled techniques, with strong quality checks throughout, to create high-performance and reliable BGA products. Trust PCBCart to turn your designs into strong and dependable solutions, ensuring every detail is perfect.

BGA Product Assembly Process at PCBCart

Key Points & Control in BGA Product Production

Process Key Points Control Method Picture
PCB Design

1. Pad design

2. Residualcopper rate

3. High Tg board

4. Layout method

5. Surface finish

6. Lead or lead free

1. Reference IPC Specification

2. Specification of parts

3. Gerber file Review

4. DFM check (30mm from the edge of the board)

5. Pad size: BGA pad 08~1.2

6. Pad type: NSMD

7. Layout, stamp holes design

8. Residual copper rates≤15%
Non Solder Mask Defined in the PCB Design Process | PCBCart

NON Solder

Mask Defined

Solder Mask Defined (Not Recommended) in the PCB Design Process | PCBCart

Solder Mask Defined

(Not Recommended)
Producibility Review

1. Whether the pad design is reasonable

2. Whether the parts interfere

3. Confirm the layout

4. Confirm the BOM

5. Confirm the pick and place file

6. Confirm the special process

1. DFM software&PCB design specification

2. Output DFM reports and suggestions

3. Suggest the layout

4. Polarity confirmation

5. System control

6. List of ESD sensitive components

7. Temperature specification list of parts
DFM checking software is used during the Producibility Review Process | PCBCart

DFM checking

softwarer

Unreasonable design: via is unfilled and plated in the pad during the Producibility Review Process | PCBCart

unreasonable design

Via is unfilled and

plated in the pad
PCB Fabrication

1. Confirm PCB specifications

2. PCB manufacturing capability

3. Define PCB process & parameters

4. Production data documents

5. Test &packaging protection

1. DFM software

2. Output the DFM report and propose EQ

3. Communicate with customer&Confirm abnormity

4. Make manufacturing order

5. CAM data production

6. PCB fabrication

7. QC,FQC, AOI

8. Test and final inspection

9. Packing
Handling MicroStar BGA Package in the PCB Fabrication Process | PCBCart

A = Via pad on package

B = Land pad on PCB
Incoming Material & Storage

1. Quantities & Batches

2. Packaging

3. Quality inspection

4. Storage conditions

5. Chip material wear

1. Bar code & System control

2. Bake & vacuum pack

3. Defective DMR

4. Oven parameters

5. Bake records

6. Feeding confirmation record

7. ESD control
Bake is performed during the Incoming Material & Storage Process | PCBCart

Bake

Materials are vacuum packaged during the Incoming Material & Storage Process | PCBCart

Vacuum package
Stencil & Jigs

1. Thickness of stencil

2. Opening mode of stencil

3. Ratio of width to thickness

4. Stencil production process

5. SMT jigs

1. Confirm the final opening stencil file

2. Stencil opening specification

3. Tension confirmation

4. Hole wall observation

5. System logging

6. IPC-7521 specification
Ensure the stencil matches design specifications before production | PCBCart

Stencil confirmation
Production Arrangements

1. Confirm BOM &SOP

2. Confirm the moisture sensitive components

3. Confirm whether the PCB is baked

4. Key material packing method

5. ESD protection & temperature and humidity control

6. Production requirements

7. Material accuracy

1. MES process control & online SOP

2. Electrostatic grounding,electrostatic bracelet

3. Special process mark

4. Baking system record

5. Feeding list & temperature and humidity spot check list

6. List of quantities

7. Key control propaganda
ESD (Electrostatic Discharge) Protection Gate in the Production Arrangements Process | PCBCart

ESD electrostatic gate

Unreasonable Design: Via Is Unfilled and Plated in the Pad in the Production Arrangements Process | PCBCart

Personnel ESD electrostatic protection
Printing

1. Parameter of printing

2. PCB flow direction

3. Solder paste selection

4. Solder paste back temperature

5. Stability of equipment

6. 5S

1. SPI monitoring

2. Support fixture use

3. Printing parameter confirmation

4. Solder paste MES control

5. Process system control

6. First article confirmation

7. PCB lot &Package &Quantity

8. Substrate box transportation
100% Solder Paste Inspection (SPI) in the Printing Process | PCBCart

100% SPI

3D Imaging of Solder in the Printing Process | PCBCart

3D imaging of solder
Parts Mounting

1. Mounting parameter

2. Program version

3. ESD & Temperature and humidity

4. Correct material

5. Nozzle use

6. Transfer board

7. Time management

1. Feeding list (Nozzle,Feeder)

2. Quality&Production check materials

3. Spot check of equipment

4. Transmission board speed setting

5. X-ray confirmation

6. Electrostatic ring,electrostatic glove,ion air gun

7. First article confirmation of the three parties (production,engineering, quality)

8. MES control

9. SOP&5S control

10. Solder paste board production time≤2H
High-Precision Mounting Machine in the Parts Mounting Process | PCBCart

High precision mounting machine

X-ray Inspection Machine in the Parts Mounting Process | PCBCart

X-ray inspection machine

First Article Confirmation in the Parts Mounting Process | PCBCart

First article confirmation
Soldering (reflow + selective soldering)

1. Furnace temperature parameters

2. Oxygen content ≤7000PPM

3. Temperature measurement plate&furnace temperature curve

4. Equipment temperature zone ≥10, nitrogen

5. The welding appearance conforms to IPC Class iii

6. Bubble ≤25%

7. Climb tin height ≥75%

8. Choose to weld the through parts

9. ESD&Temperature&Humidity control

1. Temperature measuring plate (BGA solder joint position)

2. Uniform distribution of temperature measurement points

3. Measured furnace temperature curve

4. Oxygen content real-time monitoring

5. Printing to reflow soldering time(single side ≤4H,double side s12H)

6. Set the maximum temperature based on the specification

7. Board direction

8. The smooth conveyor belt

9. Solder paste specification

10. First article confirmation

11. X-ray inspection

12. AOI check

13. AGV handling

14. Special tray

15. Selective soldering parameters
12-Zone Nitrogen Reflow Oven in the Soldering Process | PCBCart

12 temperature zone nitrogen reflow oven

X-ray Inspection in the Soldering Process | PCBCart

X-ray Inspection

BGA Temperature Measurement Point in the Soldering Process | PCBCart

BGA temperature measurement point

Selective Soldering in the Soldering Process | PCBCart

selective soldering

AGV (Automated Guided Vehicle) Handling in the Soldering Process | PCBCart

AGV vehicle handling
Washing

1. Solvent selection

2. Cleaning parameters

3. Concentration detection

4. Baking parameters

5. Cleaning quality

6. ESD &Temperature & Humidity control

7. Carry

1. Cleaning fixture and fixture acceptance

2. SOP defines the operation mode of parameter

3. Inspection & process record

4. System logging

5. Surface ion concentration test

6. First article confirmation

7. Resistivity detection

8. ZESTRONA201

9. Baking time after cleaning > 8H (75℃)

10. AGV workshop

11. Electrostatic protection

12. Special tray
Washing Station in the Washing Process | PCBCart

Washing Place

Resistivity Monitoring in the Washing Process | PCBCart

Resistivity monitoring
Inspection

1. AOl program

2. SOP&Process control

3. General inspection&FQC inspection

4. ESD & Temperature & Humidity control

5. Carry

1. 100% pass-SMT 3D AOI

2. 100% pass DIP plug-in AOI

3. 100% general inspection

4. 100% quality inspection

5. Handling by AGV vehicle

6. Equipment and personnel electrostatic protection

7. Special tray

8. System control

9. Finished product inspection report
3D AOI (Automated Optical Inspection) in the Inspection Process | PCBCart

3D AOI
Packing

1. Stress<400 u strain

2. Product anti-collision protection

3. ESD&Temperature&Humidity control

4. Burrs and dust

5. Quantity

1. Milling cutter splitter

2. Special tray

3. Electrostatic bag,desiccant

4. Dust cleaning

5. Barcode &label control

6. System control
Depaneling Machine in the Packing Process | PCBCart

depaneling machine

Depaneling Stress (Max 92 µstrain) in the Packing Process | PCBCart

Depaneling stress (max 92 u strain )

Packing (Anti-Damage & Anti-Static) in the Packing Process | PCBCart

Packing (anti-damage & anti-static)

Our BGA Assembly Products Showcase

BGA (imaging sensor) - PCBCart
BGA (imaging sensor)
BGA (imaging sensor) - PCBCart
BGA (imaging sensor)
WLCSP (Controller + Storage) - PCBCart
WLCSP (Controller + Storage)
PGA (Programmable device) - PCBCart
FPGA (Programmable device)
FPGA& FC-BGA (Programmable device+ Storage) - PCBCart
FPGA & FC-BGA (Programmable device + Storage)
FPGA (Programmable device + Storage) - PCBCart
FPGA (Programmable device + Storage)
BGA Assembly X-ray Inspection Case-1
BGA Assembly X-ray Inspection Case-2
BGA Assembly X-ray Inspection Case-3
BGA Assembly X-ray Inspection Case-4
BGA Assembly X-ray Inspection Case-5
BGA Assembly X-ray Inspection Case-6
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Why Choose PCBCart BGA Assembly Services?

Standards-driven PCB design and assembly aligned with IPC standards | PCBCart Standards-Driven Excellence: Every design and assembly step aligns with IPC benchmarks.
Proactive PCB layout and process optimization to prevent defects | PCBCart Defect Prevention: Proactive optimization of layouts and processes for zero-failure outcomes.
End-to-end compliance from PCB design to delivery ensuring quality and technical standards | PCBCart End-to-End Compliance: From design to delivery, we guarantee adherence to your technical and quality requirements.

By integrating these standards, PCBCart ensures robust, high-yield BGA assemblies that meet the demands of cutting-edge applications. Let us turn your designs into dependable, industry-compliant solutions.

98.5%

Qualified Rate

1

Time Pass

99%

Satisfaction
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