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BGA Pad Design: SMD vs NSMD and When Via-in-Pad Is Worth It

SMD vs NSMD BGA pads by pitch, dog-bone vs via-in-pad, and why VIP must be filled and capped. ...

Panelization for Assembly: Rails, Fiducials, Tooling Holes, Breakaways

Panel rails, fiducials, tooling holes and V-score vs tab routing, set by what the SMT line needs. ...

Reflow Profiles: Why One Temperature Curve Does Not Fit Every Board

Why reflow temperature profiles must be set per board, and what you can do to help. ...

Metal-Core PCBs: Design Rules That Affect Assembly Yield

Aluminum PCB design guidelines for reflow: dielectric specs, copper limits, holes and pad voids. ...

Heavy Copper PCB Design Guidelines: Trace, Spacing, Reflow

Heavy copper PCB design guidelines: trace/spacing by oz, annular ring, finishes and reflow. ...

Rogers PCB DFM: Material, Stack-Up and Finish Choices for RF Boards

Rogers PCB design guidelines: pick laminate, stack-up and finish with fabrication limits in mind. ...

IC Programming During Assembly: Designing Access and Preparing Your Files

How to prepare your design and files so IC programming fits smoothly into assembly. ...

PCB Surface Finish for BGA: ENIG, ENEPIG, ImAg, OSP

ENIG, ENEPIG, ImAg or OSP for BGA and fine pitch? Compare flatness, reflow cycles, black pad. ...

The Fab Drawing & Readme Checklist CAM Engineers Wish You Sent

What to put on a PCB fabrication drawing and readme so CAM can build it. Copy-ready checklist. ...

Top CAM Hold Reasons and How to Clear Them Before Submission

Why CAM puts a PCB order on hold, and how to clear common engineering queries before submitting. ...
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