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Handling ECOs Mid-Build in HMLV Programs

Handle mid-build ECOs in HMLV PCB assembly: change types, data needed, and WIP disposition. ...

First Article Inspection in NPI: What to Request

First article inspection for PCB assembly: records to request and when to repeat it. ...

NPI to Low-Volume Production: Gates and Handoffs

How EVT, DVT and PVT map to prototype, pilot and low-volume PCBA builds, with gate checks. ...

What HMLV Means for Your Setup Cost, BOM and Lead Time

How HMLV orders split setup cost, BOM and lead time, and when to merge lots or unify parts. ...

EMI Shield Covers in PCB Assembly: Planning Placement, Access, and Inspection

Plan EMI shield footprint, grounding and test access at layout to avoid costly PCBA rework. ...

DFT Test Point Rules for ICT and Flying Probe

PCB test point rules for ICT and flying probe: size, spacing, placement, coverage, test data. ...

QFN Thermal Pad Stencil Design to Control Voiding

How windowpane apertures, thermal via treatment and foil thickness reduce QFN thermal pad voiding. ...

0201/01005 Land Patterns and Stencil Design

How to size 0201 and 01005 pads, set stencil area ratio, and decide when 0402 is the safer choice. ...

Double-Sided SMT Assembly: How the Second Side Changes Your Design Decisions

How a second reflow pass shapes part placement, support and heat balance on double-sided boards. ...

BGA Pad Design: SMD vs NSMD and When Via-in-Pad Is Worth It

SMD vs NSMD BGA pads by pitch, dog-bone vs via-in-pad, and why VIP must be filled and capped. ...
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