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What HMLV Means for Your Setup Cost, BOM and Lead Time

How HMLV orders split setup cost, BOM and lead time, and when to merge lots or unify parts. ...

EMI Shield Covers in PCB Assembly: Planning Placement, Access, and Inspection

Plan EMI shield footprint, grounding and test access at layout to avoid costly PCBA rework. ...

DFT Test Point Rules for ICT and Flying Probe

PCB test point rules for ICT and flying probe: size, spacing, placement, coverage, test data. ...

QFN Thermal Pad Stencil Design to Control Voiding

How windowpane apertures, thermal via treatment and foil thickness reduce QFN thermal pad voiding. ...

0201/01005 Land Patterns and Stencil Design

How to size 0201 and 01005 pads, set stencil area ratio, and decide when 0402 is the safer choice. ...

Double-Sided SMT Assembly: How the Second Side Changes Your Design Decisions

How a second reflow pass shapes part placement, support and heat balance on double-sided boards. ...

BGA Pad Design: SMD vs NSMD and When Via-in-Pad Is Worth It

SMD vs NSMD BGA pads by pitch, dog-bone vs via-in-pad, and why VIP must be filled and capped. ...

Panelization for Assembly: Rails, Fiducials, Tooling Holes, Breakaways

Panel rails, fiducials, tooling holes and V-score vs tab routing, set by what the SMT line needs. ...

Reflow Profiles: Why One Temperature Curve Does Not Fit Every Board

Why reflow temperature profiles must be set per board, and what you can do to help. ...

Metal-Core PCBs: Design Rules That Affect Assembly Yield

Aluminum PCB design guidelines for reflow: dielectric specs, copper limits, holes and pad voids. ...
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