BGA (Ball Grid Array) is a packaging technology of an integrated circuit, mainly for the production of high-performance electronic products, with spherical solder balls to connect the chip and the PCB.
Current Popular BGA Packages
FPGA (Field Programmable Gate Array)
FC-BGA (Flip Chip Ball Grid Array)
WLCSP (Wafer Level Chip Scale Package)
Benefits of BGA Packaging
High Density and Versatility
Although the number of I/O pins in BGA packaging has increased, the pin pitch is comparatively large, which enhances the assembly yield. This makes BGA the optimum choice for high-density and high-performance, multi-functional, and high I/O pin packaging.
Higher Signal Transmission Speed
Signal transmission delay is minimized due to smaller parasitic parameters, thus significantly enhancing the operating frequency.
High Reliability
Coplanar soldering during assembly is utilized by BGA packaging, which enhances reliability.
Excellent Electrical and Thermal Performance
Same capacity, but BGA packaging is a third the size of TSOP packaging, as against traditional packaging methods (QFN, QFP, SOP). It provides a direct, shorter path for thermal dissipation, resulting in excellent electrical and thermal performance.
BGA Product-Related Standards
To ensure easy integration and reliability of BGA (Ball Grid Array), PCBCart meets universally accepted industry standards. The below are the principal frameworks guiding our process:
IPC-7351B: Printed Circuit Board Design Guidelines
The standard is primarily a guide to printed circuit board (PCB) design. For BGA components, IPC-7351B has explicit guidelines for:
Pad Layout: Requirements of the design for the shapes and sizes of the pads so that they would line up and come into contact with the solder balls of BGA efficiently.
Spacing and Tolerances: Specifications for maintaining the pads at adequate spacing and setting acceptable tolerances so that issues like bridging and misalignment during assembly are prevented.
Design Optimization: Methods for adapting PCB designs to accommodate different types of BGA packages, thereby optimizing soldering defects and overall electronic assembly reliability.
IPC-A-610: Assembly Acceptance Criteria
Committed to quality electronic assembly, this standard details rigorous acceptance criteria for soldering BGA, including:
Solder Joint Integrity: Joint shape, size, and location evaluation.
Defect Identification: Voids, cracks, or misalignment identification criteria.
Visual & Mechanical Inspection: Long-term functionality conformance criteria.
IPC-7095: Best Practices for Reflow Soldering of BGA
This standard simplifies reflow soldering processes for BGA devices with emphasis on:
Temperature Profiling: Precise control of preheat areas, peak temperatures, and cooling rates.
Process Consistency: Guidelines to prevent thermal shock and ensure uniform solder joint formation.
Reliability Enhancements: Prevention of head-in-pillow or bridging defects.
IPC-A-600: PCB Manufacturing Quality
This standard specifies PCB manufacturing quality with BGA requirements such as:
Pad Surface Condition: Smoothness, resistance to oxidation, and cleanliness.
Aperture Tolerances: Drilling accuracy within via-in-pad or microvias.
Material Integrity: Ability of the substrate to withstand temperature stress and layers to register over it.
Quality Assurance in BGA Inspection
Since placement of solder balls in BGA packages is extremely precise, inspecting BGA packages is virtually impossible with basic optical methods having limitations to recognize defects. High precision in assembling BGAs for SMT relies on advanced technologies that are implemented:
Electrical Testing: It is a standard test that effectively identifies open and short circuit faults to ensure correct connections.
Boundary Scan Inspection: This involves utilizing the boundary scan inspection feature of the boundary scan design and inspecting every solder joint in the boundary connector to detect opens and shorts.
Automatic X-ray Inspection: Unlike AOI that examines visible joints, this method scans beneath the components to reveal concealed issues like bubbles and voids. It is able to identify typical BGA defects like misalignment, loose solder, open circuit, cold joints, bridging shorts, cavities, displaced or missing solder balls, and size variations.
PCBCart is a reliable PCB assembly and production expert with special BGA production skills as part of their core products. PCBCart excels in PCB assembly and designing for BGA package types, noted for having their complex solder ball grid allowing them to offer high-density interconnects. PCBCart offers an exhaustive testing and inspection process for BGA-PCB products prior to dispatching them for shipping.
Customized for use in the age of electronics, PCBCart's BGA services aim at meeting different requirements of customers when it comes to mounting BGA packages onto PCB designs while focusing on accuracy and high-quality deliverables.
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Helpful Resources
• Design Requirement of SMT PCBs Part One: Bonding Pad Design of Some Ordinary Components
• Design Requirement of SMT PCBs Part Two: Settings of Pad-Trace Connection, Thru-Holes, Test Point, Solder Mask and Silkscreen
• Design Requirement of SMT PCBs Part Three: Component Layout Design
• Design Requirement of SMT PCBs Part Four: Mark
• Full Feature PCB Manufacturing Service from PCBCart - Multiple Value-added options
• Advanced PCB Assembly Service from PCBCart - Start from 1 piece
