A Comprehensive Introduction of Copper Clad Laminate

The development of technologies concerning copper clad laminate (CCL) derives from the increasing requirements such as thinness, lightness, shortness and miniature of electronic products, along with the development of print ...

5 "Whats" about FR-4 Copper Clad Laminates

Among the fiberglass cloth base CCL products, FR-4 CCL refers to a type of flame-retardant CCL with fiberglass cloth as its substrate material and with brominated epoxy resin or modified epoxy resin as its substrate. Through holes ...

How to Etch Printed Circuit boards at Home

PCB etching is a big topic in electronics Maker community. It's something every electronics enthusiast will set hand to when he or she steps into electronics DIY world. Though it looks like a very simple procedure, it does require dete ...

Countersink vs. Counterbore

PCBs generally need to include screw holes for fixing; as such, special holes, like countersinks and counterbores, are incorporated into the boards to allow them to be fixed in place using different types of screws. A countersink is a co ...

The Game Changer: 3D Inkjet Printing

Electronic products have developed at a lightning pace in recent years, and new technologies appear to emerge on a daily basis. The availability of these technologies allows new inventions and innovative products, one of which is the ...

Relationship between Copper Weight, Trace Width and Current Carrying Capacity

Theoretically, PCB (Printed Circuit Board) current carrying capacity is determined by cross-sectional area of trace and temperature rise. Furthermore, cross-sectional area of trace is directly proportional to trace width and copper thick ...

Problems of High-Frequency and High-Speed Multilayer PCB Fabrication and Their Solutions

Recent years have been witnessing constant improvement in electronic information technology and increasingly higher demands from people on their applications of electronic products. Complex structure and multiple functions ...

Surface Mount Assembly Procedure of PoP Components

Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard int ...

Effective Ways of Moisture Sensitive Device Storage and Handling

In terms of SMD packages, any permeable packaging material, plastic or metal, absorbs moisture from the air. When the package is exposed to the sudden high temperature of solder reflow during the assembly process, moisture will ...

Farewell to Counterfeit Electronic Components

Counterfeits show up in virtually every industry, so it's not surprising counterfeit components are a problem in the electronics industry. Although governments, companies and other stakeholders have been working to prevent cou ...

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