PCBA Process
Before assembly begins, all incoming materials,
including
fabricated PCBs and electronic components,
undergo rigorous
quality control checks.
· Accurate resistance and capacitance values
· Consistency
between component pads and the board
· Precise incoming
quantity verification
· Detection of any abnormal components
A crucial step in the surface mount PCBA process flow, solder paste
printing involves applying solder paste to a printed circuit board
(PCB). The most common method utilizes a stencil printer to
accurately deposit the correct amount and thickness of solder onto
the solder pads.
Solder Paste Inspection (SPI) aims to identify defective solder
paste printing early in the Printed Circuit Board (PCB) assembly
process. SPI directly assesses the quality of solder paste on the
PCB, helping to significantly reduce defect rates and save
considerable cost and time.
IQC Incoming Quality Control
Solder Paste Inspection (SPI)
Component placement is an electronic manufacturing PCBA process that
precisely mounts surface-mounted devices (SMDs) onto designated
locations on a printed circuit board (PCB). This step is essential
for establishing electrical interconnections between the components
and the PCB.
Manufacturers utilize Pre-Reflow Automated Optical Inspection (AOI)
to rapidly identify and address any defects before the PCBA
production moves to the next phase. This strategic inspection point
is vital for ensuring a reliable and efficient assembly process.
The reflow soldering process temporarily attaches electronic
components using solder paste. Through a controlled high-temperature
profile, the solder paste melts, allowing the surface-mounted
components to be firmly adhered to the PCB board.
Pre-Reflow Automated Optical Inspection (AOI)
Post-Reflow AOI can detect mis-soldering, reverse soldering, empty
soldering, empty soldering, lack of penetration, short circuit,
offset, tombstone, etc. after reflow soldering. It can also detect
defects such as excessive welding, insufficient welding, and
continuous welding in the appearance of PCBA solder joints.
PCBA through-hole component soldering is a vital step. Manual
soldering offers flexibility and precision for small batches and
prototyping, though with lower productivity. Wave soldering, on the
other hand, is ideal for mass production due to its high efficiency
and consistency, but it has limitations in component selection,
requires preheating, and can be more costly.
The first sample test involves cross-referencing the completed PCBA
with Gerber, BOM (Bill of Materials), and coordinate files. A
first-sample tester re-verifies the resistance and capacitance
values to confirm the accuracy of all parameter values.
Post-Reflow Automated Optical Inspection (AOI)
Through-Hole Component Soldering
X-ray inspection is commonly performed on Quad Flat No-Lead (QFN)
and Ball Grid Array (BGA) components during printed circuit board
assembly. This process checks the solder joints of otherwise
invisible components, ensuring the reliability of each solder ball
in a BGA.
The ultimate stage of the PCB assembly process is the final
inspection and functional test, which verifies that the PCB operates
as intended. Additionally, specific applications may have further
requirements. For example, automotive PCBs might undergo drop tests,
while medical PCBs may require halogen testing.
Final Inspection and Functional Test