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DFT Test Point Rules for ICT and Flying Probe

PCB test point rules for ICT and flying probe: size, spacing, placement, coverage, test data. ...

QFN Thermal Pad Stencil Design to Control Voiding

How windowpane apertures, thermal via treatment and foil thickness reduce QFN thermal pad voiding. ...

0201/01005 Land Patterns and Stencil Design

How to size 0201 and 01005 pads, set stencil area ratio, and decide when 0402 is the safer choice. ...

Double-Sided SMT Assembly: How the Second Side Changes Your Design Decisions

How a second reflow pass shapes part placement, support and heat balance on double-sided boards. ...

BGA Pad Design: SMD vs NSMD and When Via-in-Pad Is Worth It

SMD vs NSMD BGA pads by pitch, dog-bone vs via-in-pad, and why VIP must be filled and capped. ...

Panelization for Assembly: Rails, Fiducials, Tooling Holes, Breakaways

Panel rails, fiducials, tooling holes and V-score vs tab routing, set by what the SMT line needs. ...

Reflow Profiles: Why One Temperature Curve Does Not Fit Every Board

Why reflow temperature profiles must be set per board, and what you can do to help. ...

Metal-Core PCBs: Design Rules That Affect Assembly Yield

Aluminum PCB design guidelines for reflow: dielectric specs, copper limits, holes and pad voids. ...

Heavy Copper PCB Design Guidelines: Trace, Spacing, Reflow

Heavy copper PCB design guidelines: trace/spacing by oz, annular ring, finishes and reflow. ...

Rogers PCB DFM: Material, Stack-Up and Finish Choices for RF Boards

Rogers PCB design guidelines: pick laminate, stack-up and finish with fabrication limits in mind. ...
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